Method for providing a wire connection to a printed circuit board
AssigneeCurrent Lighting Solutions, LLC
InventorsEden Dubuc, Hubert Cardinal
Life of this patent
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Abstract
Provided is a method for providing a wire connection to a printed circuit board. The method includes attaching a first end of a wire at a first location on the printed circuit board and attaching a second end of the wire at a second location of the printed circuit board, to form an arched wire. The method further includes applying an encapsulant on the printed circuit board, the encapsulant forming a film through which the arched wire protrudes. Furthermore, the method includes cutting the arched wire to yield an out-of-plane wire connected to the printed circuit board.
Claims20
A method for providing a connection of a set of wires to a printed circuit board, the method comprising:
- attaching first ends of the set of wires at a first location on the printed circuit board, wherein the set of wires comprises at least two wires;
- attaching second ends of the set of wires at a second location of the printed circuit board, to form an arched set of wires;
- applying an encapsulant on the printed circuit board, the encapsulant forming a film through which the arched set of wires protrudes;
- and
- cutting the arched set of wires to yield out-of-plane wires connected to the printed circuit board;
- wherein the printed circuit board includes one or more light-emitting diodes configured to receive power from the out-of-plane wires.
A method for providing a connection of a set of wires to a set of printed circuit boards including a first printed circuit board and a second printed circuit board, the method comprising:
- attaching first ends of the set of wires at a first location on the first printed circuit board, wherein the set of wires comprises at least two wires;
- attaching second ends of the set of wires at a second location on the first printed circuit board, to form an arched set of wires, the second location being electrically connected to the first location;
- applying an encapsulant on the first printed circuit board, the encapsulant forming a film through which the arched set of wires protrudes;
- cutting the arched set of wires to yield out-of-plane wires connected to the first printed circuit board;
- and
- providing an in-plane connection from one of the first location and the second location to a third location situated on the second printed circuit board;
- wherein the printed circuit board includes one or more light-emitting diodes configured to receive power from the out-of-plane wires.
Dependencies are inferred from the claim text.