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US 10,707,556 B2Granted
Antenna-integrated radio frequency module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHong In Kim, Thomas A. Kim, Ho Kyung Kang
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Abstract
An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
Claims9
An antenna-integrated radio frequency (RF) module, comprising:
- a multilayer substrate;
- an integrated chip (IC) disposed on an outer surface of the multilayer substrate, and configured to generate a transmission signal and a reception signal;
- patch antennas disposed on a first layer of the multilayer substrate;
- first transmission vias electrically connected to the patch antennas, respectively;
- first reception vias electrically connected to the patch antennas, respectively;
- transmission lines electrically connected to the first transmission vias, respectively;
- reception lines electrically connected to the first reception vias, respectively, and separated from the transmission lines;
- second transmission vias electrically connected between the IC and the transmission lines, respectively;
- second reception vias electrically connected between the IC and the reception lines, respectively;
- a first ground member disposed between the patch antennas and the transmission lines or the reception lines, and having first penetration regions surrounding the first transmission vias and the first reception vias, respectively.
7 more elements
Dependencies are inferred from the claim text.