Packaging adhesive, packaging method, display panel and display device

A packaging method comprising:

• applying a packaging adhesive to a packaging area of a first glass substrate, wherein the packaging adhesive comprises a frit and an organic solvent and a material, with a thermal expansion coefficient larger than a thermal expansion coefficient of the frit, wherein the frit is borosilicate glass and the material with the thermal expansion coefficient larger than the thermal expansion coefficient of the frit is quartz;
• and
• attaching the first glass substrate to a second glass substrate facing the first glass substrate,
• wherein applying the packaging adhesive further comprises removing the organic solvent by heating the packaging adhesive to form a packaging layer on the packaging area;
• and
• attaching the first glass substrate further comprises irradiating the packaging layer using a laser to form a sealing structure between the first glass substrate and the second glass substrate,
• wherein the applying the packaging adhesive further comprises:
• applying at least two layers of the packaging adhesive in sequence to the packaging area of the first glass substrate, each respective layer of the packaging adhesive of the at least two layers of packaging adhesive forming one respective packaging layer after the organic solvent is removed by heating each respective layer of packaging adhesive of the at least two layers of packaging adhesive, so as to form at least two packaging layers in a stack;
• wherein for each respective packaging layer of the at least two packaging layers in the stack, a thermal expansion coefficient of a first packaging layer of the at least two packaging layers in the stack formed by applying at least two layers of the packaging adhesive in sequence is greater than a thermal expansion coefficient of a second packaging layer of the at least two packaging layers in the stack formed by applying at least two layers of the packaging adhesive in sequence.