Ultrasonic device, method for manufacturing the same, electronic device and ultrasonic imaging device
AssigneeSeiko Epson Corporation
InventorKanechika Kiyose
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Abstract
An ultrasonic device includes a substrate having a first opening, a second opening and a wall part partitioning the first opening and the second opening; a first vibration film and a second vibration film which close the first opening and the second opening respectively; a first piezoelectric element and a second piezoelectric element which are formed on surfaces of the first vibration film and the second vibration film opposite to the substrate; an acoustic matching layer which is disposed within the first opening and the second opening so as to come into contact with the first vibration film and the second vibration film.
Claims9
A ultrasonic device comprising:
- a substrate which has a first opening, a second opening and a wall part partitioning the first opening and the second opening;
- a flexible film which is formed on the substrate and closes the first opening and the second opening;
- a first piezoelectric element and a second piezoelectric element which are formed on the flexible film at positions overlapping the first opening and the second opening, respectively, in a plan view;
- and
- a first silicon resin member and a second silicon resin member which are disposed within the first opening and the second opening respectively.
Dependencies are inferred from the claim text.