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US 10,707,403 B2Granted
Electronic component-containing module
AssigneeMurata Manufacturing Co., Ltd.
InventorYoshiharu Suemori
Life of this patent
Estimating the term…
Abstract
An electronic component-containing module includes a board, electronic components, and a sealing resin and includes a space provided between the board and at least one of the electronic components. The dryness factor of the sealing resin is about 60% or more where, after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of a brazing filler metal.
Claims19
An electronic component-containing module comprising:
- a board;
- land electrodes provided on at least one principal surface of the board;
- an electronic component that includes terminal electrodes and is mounted on the at least one principal surface of the board such that the terminal electrodes are fixed to the land electrodes with a brazing filler metal;
- and
- a sealing resin provided on the at least one principal surface of the board to cover the electronic component;
- wherein
- the electronic component-containing module includes a space provided between the board and the electronic component;
- where after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of the brazing filler metal, a dryness factor of the sealing resin is about 60% or more;
- and
- the dryness factor of the sealing resin is determined by ((W2−W3)/(W2−W1))×100(%), wherein
- W1 is a mass of a sample of the sealing resin before the electronic component-containing module is moisturized,
- W2 is a mass of the sample of the sealing resin after the electronic component-containing module is moisturized, and
- W3 is a mass of the sample of the sealing resin after being heated to the re-melting temperature.
10 more elements
An electronic component-containing module comprising:
- a board;
- land electrodes provided on at least one principal surface of the board;
- an electronic component that includes terminal electrodes and is mounted on the at least one principal surface of the board such that the terminal electrodes are fixed to the land electrodes with a brazing filler metal;
- and
- a sealing resin provided on the at least one principal surface of the board to cover the electronic component;
- wherein
- the electronic component-containing module includes a space provided between the board and the electronic component;
- where after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of the brazing filler metal, a dryness factor of the sealing resin is about 60% or more;
- the dryness factor of the sealing resin is determined by ((W2−W3)/(W2−W1))×100(%), wherein
- W1 is a mass of a sample of the sealing resin before the electronic component-containing module is moisturized,
- W2 is a mass of the sample of the sealing resin after the electronic component-containing module is moisturized, and
- W3 is a mass of the sample of the sealing resin after being heated to the re-melting temperature;
- and
- the sealing resin includes a filler that is made of SiO2.
11 more elements
Dependencies are inferred from the claim text.