Micro LED structure and method of manufacturing same

A micro LED structure comprising:

• a micro LED;
• a circuit board driving the micro LED;
• and
• an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED,
• wherein the anisotropic conductive anodic oxide film includes pores formed by anodizing a metal and a through-hole having a hole size larger than that of the pores, and
• wherein the through-hole is located in a first region where the micro LED is provided, the through-hole being filled with a conductive material to electrically connect the circuit board and the micro LED, and
• wherein the pores in a second region where the micro LED is not provided, the pores in the second region not being filled with the conductive material.

A method of manufacturing a micro LED structure, the method comprising:

• preparing an anisotropic conductive anodic oxide film by filling a conductive material in pores or a through hole of an anodic oxide film formed by anodizing a metal;
• forming a metal pad on the anisotropic conductive anodic oxide film;
• and
• mounting a micro LED on the metal pad,
• wherein, when the conductive material fills the pores, the anisotropic conductive anodic oxide film includes the pores including first pores and second pores, the first pores are located in a first region where the micro LED is provided, the first pores being filled with a conductive material to electrically connect a circuit board and the micro LED, and the second pores are located in a second region where the micro LED is not provided, the second pores not being filled with the conductive material, and
• wherein, when the conductive material fills the through hole, the anisotropic conductive anodic oxide film includes third pores and the through-hole having a hole size larger than that of the third pores, the through-hole is located in a third region where the micro LED is provided, the through-hole being filled with the conductive material to electrically connect the circuit board and the micro LED, and the third pores in a fourth region where the micro LED is not provided, the third pores in the fourth region not being filled with the conductive material.