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US 10,707,388 B2Granted
Semiconductor device, and method for manufacturing semiconductor device
AssigneeNichia Corporation
InventorsTeppei Kunimune, Masafumi Kuramoto
Life of this patent
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Abstract
A semiconductor device includes a base, a semiconductor element mounted on the base, a porous metal sintered body and a sealing member. The porous metal sintered body is provided on the base in an area different from an area on which the semiconductor element is mounted. The sealing member covers the semiconductor element. The sealing member is placed inside the porous metal sintered body.
Claims19
A semiconductor device comprising:
- a base;
- a semiconductor element mounted on the base;
- a porous metal sintered body provided on the base in an area different from an area on which the semiconductor element is mounted, the metal sintered body having silver as a main component;
- and
- a sealing member covering the semiconductor element, the sealing member being placed inside the porous metal sintered body.
2 more elements
A manufacturing method for a semiconductor device, comprising:
- mounting a semiconductor element on a base;
- applying a first metal powder sintering paste or second metal particles on an area of the base different from an area that the semiconductor element is mounted on, the first metal powder sintering paste containing first metal particles and a dispersion medium;
- applying a temperature of 160° C. to 300° C. to the first metal powder sintering paste or the second metal particles, and sintering the first metal particles or the second metal particles to form a porous metal sintered body;
- placing a sealing member on the base on which the porous metal sintered body is placed;
- and
- curing the sealing member after the sealing member has infiltrated to an interior of the porous metal sintered body.
3 more elements
A semiconductor device comprising:
- a base having a base material with copper or a copper alloy as a main component;
- a semiconductor element mounted on the base;
- a porous metal sintered body provided on the base in an area different from an area on which the semiconductor element is mounted;
- and
- a sealing member covering the semiconductor element, the sealing member being placed inside the porous metal sintered body.
2 more elements
A semiconductor device comprising:
- a base that is plated with silver, gold, aluminum, or an alloy containing one or more of silver, gold and aluminum as a main component;
- a semiconductor element mounted on the base;
- a porous metal sintered body provided on the base in an area different from an area on which the semiconductor element is mounted;
- and
- a sealing member covering the semiconductor element, the sealing member being placed inside the porous metal sintered body.
2 more elements
Dependencies are inferred from the claim text.