Dicing a wafer of light emitting devices
AssigneeLumileds LLC
InventorsSatyanarayana Rao Peddada, Frank L. Wei
Life of this patent
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Abstract
Some embodiments include a III-nitride light emitting device with a light emitting layer disposed between an n-type region and a p-type region. A glass layer is connected to the III-nitride light emitting device. A wavelength converting layer is disposed between the III-nitride light emitting device and the glass layer. The glass layer is narrower than the III-nitride light emitting device.
Claims7
A method of dicing a wafer, the method comprising:
- providing a glass layer;
- providing a light emitting device layer comprising light emitting devices and a dielectric material between the light emitting devices;
- providing a wavelength converting layer between the glass layer and the light emitting device layer, the wavelength converting layer comprising particles;
- sawing through the glass layer and the wavelength converting layer with a first metal-bonded diamond grit blade such that an abrasion level of the first metal bonded diamond grit blade is maintained by the particles in the wavelength converting layer;
- and
- sawing through the dielectric material between the light emitting devices in the light emitting device layer with a second metal-bonded diamond grit blade, the first metal-bonded diamond grit blade being wider than the second metal-bonded diamond grit blade.
A method of dicing a wafer comprising a glass layer, a light emitting device layer including light emitting devices and a dielectric material between the light emitting devices, the method comprising:
- forming a wavelength converting layer between the glass layer and the light emitting device layer, the wavelength converting layer comprises at least 50% phosphor particles by volume and the phosphor particles are at least 10 μm in diameter;
- sawing through the glass layer and the wavelength converting layer with a first metal-bonded diamond grit blade;
- and
- creating, by the at least 50% phosphor particles by volume in the wavelength converting layer, a self-dressing effect on the metal-bonded diamond grit blade, to maintain an abrasion level.
Dependencies are inferred from the claim text.