Multi-chip packaging structure for an image sensor

A multi-chip packaging structure comprising:

• a first substrate having a first surface and a second surface, the first substrate including conductive traces on the first and second surfaces;
• an image sensor device coupled to at least one of the conductive traces on the first surface of the first substrate;
• at least one conductive element coupled to the first substrate and the image sensor device;
• an image signal processor (ISP) integrated circuit (IC) die coupled to at least one of the conductive traces on the second surface of the first substrate;
• a second substrate having a first surface and a second surface, the second substrate including conductive traces on the first and second surfaces of the second substrate, the second substrate being communicatively connected to the first substrate;
• at least one insulating layer disposed between the first substrate and the second substrate;
• and
• a plurality of semiconductor devices coupled to the conductive traces on the first surface of the second substrate, the plurality of semiconductor devices including a memory IC die and a driver IC die.

A method of fabricating a multi-chip packaging structure, the method comprising:

• coupling a first device and a second device to a first surface of a first substrate, the first substrate including conductive traces on the first surface and a second surface of the first substrate;
• disposing a first insulating layer on the first surface of the first substrate;
• disposing a third device on the first insulating layer;
• disposing a second insulating layer on the third device and the first insulating layer;
• disposing a second substrate on the second insulating layer, the second substrate including conductive traces on first and second surfaces of the second substrate;
• coupling an image sensor device to the second substrate;
• and
• coupling at least one bond wire to the image sensor device and at least one bond wire to the second substrate.