Camera module having support member with extension structure

A camera module, comprising:

• a circuit board;
• a photosensitive chip coupled to the circuit board and having a photosensitive surface, the photosensitive surface comprising a photosensitive region;
• a package material body attached on the circuit board;
• and
• a support member mounted on a side of the package material body away from the circuit board;
• wherein the support member comprises a support body and an extension structure located on an inner wall of the support body, a side of the support body away from the package material body is coplanar with a side of the extension structure away from the package material body, and an orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region;
• and
• wherein a distance from a distal end of the orthographic projection of the extension structure away from the support body on the photosensitive surface to the photosensitive region ranges from about 100 μm to about 500 μm.