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US 10,707,200 B2Granted
Semiconductor device
AssigneeMurata Manufacturing Co., Ltd.
InventorsKenji Sasaki, Takayuki Tsutsui, Isao Obu, Yasuhisa Yamamoto
Life of this patent
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Abstract
An amplifier circuit including a semiconductor element is formed on a substrate. A protection circuit formed on the substrate includes a plurality of protection diodes that are connected in series with each other, and the protection circuit is connected to an output terminal of the amplifier circuit. A pad conductive layer at least partially includes a pad for connecting to a circuit outside the substrate. The pad conductive layer and the protection circuit at least partially overlap each other in plan view.
Claims18
A semiconductor device comprising
- an amplifier circuit including a semiconductor element formed on a substrate;
- a protection circuit including a plurality of protection diodes that are formed on the substrate and that are connected in series with each other, the protection circuit being connected to an output terminal of the amplifier circuit;
- and
- a pad conductive layer at least partially including a pad for connecting to a circuit outside the substrate, wherein
- the pad conductive layer and the protection circuit at least partially overlap each other in plan view,
- the plurality of protection diodes constitute a diode array folded back halfway in plan view, and part of the protection circuit is arranged outside the pad conductive layer, and
- the plurality of protection diodes include pn junctions.
4 more elements
Dependencies are inferred from the claim text.