Semiconductor device package having a mounting plate with protrusions exposed from a resin material
AssigneeToshiba Memory Corporation
InventorsSatoshi Tsukiyama, Hideo Aoki, Yoshiaki Goto
Life of this patent
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Abstract
According to one embodiment, a semiconductor device of an embodiment includes a substrate, a metal plate having a main portion having a first width in a first direction and a second width in a second direction orthogonal to the first direction, a first semiconductor chip located between the metal plate and the substrate, the first semiconductor chip having a third width in the first direction and a fourth width in the second direction, and a second semiconductor chip located between the first semiconductor chip and the substrate, wherein the first width is smaller than the third width, and the second width is smaller than the fourth width.
Claims18
A semiconductor device, comprising:
- a substrate;
- a metal plate having a main portion having a first width in a first direction and a second width in a second direction orthogonal to the first direction;
- a first semiconductor chip located between the metal plate and the substrate, the first semiconductor chip having a third width in the first direction and a fourth width in the second direction;
- a second semiconductor chip located between the first semiconductor chip and the substrate;
- and
- a resin material extending over the main portion of the metal plate, wherein
- the first width is smaller than the third width, and the second width is smaller than the fourth width,
- the resin material extends over the first semiconductor chip and the second semiconductor chip, the resin material including a side surface,
- the metal plate includes a first protruding portion, a second protruding portion, a third protruding portion, and a fourth protruding portion, each protruding from the main portion of the metal plate, and
- a surface of the first protruding portion, a surface of the second protruding portion, a surface of the third protruding portion, and a surface of the fourth protruding portion are exposed at the side surface of the resin material.
A semiconductor device, comprising:
- a mounting bed having a mounting surface, opposed first and second sides on opposite sides of the mounting bed, and opposed third and fourth sides on opposite sides of the mounting bed, the mounting surface having a first surface area;
- a first semiconductor chip having a mounting surface facing the mounting surface of the mounting bed, wherein the surface area of the mounting surface of the first semiconductor chip is greater than the surface area of the mounting surface of the mounting bed and the sides of the semiconductor chip extend outwardly of the four sides of the mounting bed;
- a first projecting portion extending from the first side of the bed and outwardly of the mounting surface of the first semiconductor chip;
- a second projecting portion extending from the first side of the bed and outwardly of the mounting surfaces of the first semiconductor chip;
- and
- a resin extending over the mounting bed and the first semiconductor chip, wherein
- the first and second sides extend in a first direction, and the first and second projecting portions extend from the mounting surface of the mounting bed in a second direction generally orthogonal to the first direction and end in a tip end, and
- the tip ends of the first and second projecting portions are not covered by the resin.
Dependencies are inferred from the claim text.