LED backplane having planar bonding surfaces and method of making thereof

A light emitting device assembly comprising:

• a backplane comprising a substrate containing metal interconnect structures;
• insulating material portions having a lower elastic modulus than the substrate, wherein the insulating material portions are located over the backplane and contain a respective planar top surface region such that the planar top surface regions of the insulating material portions are located within a same horizontal plane;
• a two-dimensional array of metal plate clusters, wherein each of the metal plate clusters comprises a plurality of metal plates, each metal plate including a horizontal metal plate portion overlying a planar top surface region of a respective insulating material portion and a connection metal portion extending between the horizontal metal plate portion and a respective one of the metal interconnect structures;
• and
• a two-dimensional array of light emitting device clusters bonded to the backplane through respective bonding structures, wherein each light emitting device cluster comprises a plurality of light emitting devices overlying a respective metal plate cluster.