US 10,707,188 B2Granted

Light emitting device

AssigneeNichia Corporation

InventorHaruaki Sasano

Life of this patent

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Abstract

There is presented a light emitting device, having plural light emitting elements disposed on a substrate, in which a protection element, such as a zener diode, can be disposed at an appropriate position. The light emitting device includes: a substrate; a light emitting section having plural light emitting elements disposed in a mounting area on the substrate; a positive electrode and negative electrode each having a pad section and wiring section to apply voltage to the light emitting section through the wiring sections; a protection element disposed at one of the positive electrode and negative electrode and electrically connected with the other one electrode; and a light reflecting resin formed on the substrate such as to cover at least the wiring sections and the protection element, wherein the wiring sections are formed along the periphery of the mounting area such that one end portions thereof are adjacent to each other.

Claims24

Dependent claims

A light emitting device, comprising:

a substrate;
a light emitting section including a plurality of light emitting elements disposed on a mounting area of the substrate;
at least one electrode disposed on the substrate separate from the mounting area and having a wiring section at least part of which is located along a ring shaped periphery of the light emitting section in the plan view and a pad section electrically connected with the wiring section;
a wire electrically connected to the light emitting elements and directly connected to the wiring section;
and
a protection element disposed on the wiring section,
wherein the wiring section has a continuously formed part between a portion of the wiring section connected with the wire and a portion of the wiring section on which the protection element is disposed, and
wherein the continuously formed part has a slit, the slit being formed to extend substantially perpendicular to a direction in which the ring shaped periphery and the continuously formed part extend.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/699,214Filed 8 Sep 2017 · continuation
Priority: JP 2010-09471816 Apr 2010
Published: US 2018/0012875 A111 Jan 2018
Granted: 7 Jul 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification7 codes

H10W 90/00
Package configurations
H10H 20/825
Comprising only Group III-V materials, e.g. GaP: containing nitrogen, e.g. GaN
H10H 20/856
Optical field-shaping means, e.g. lenses: reflecting means
H10H 20/857
Packages: interconnections, e.g. lead-frames, bond wires or solder balls

Family

Application13/087,950Parent of this division · filed 15 Apr 2011
Application14/966,160Parent of this continuation · filed 11 Dec 2015
US 9,245,873 B2Parent of this division · filed 26 Jan 2016
US 2018/0012875 A1Pre-grant publication · published 11 Jan 2018
US 9,786,637 B2Parent of this continuation
Application14/966,160Parent of this division
US 2011/0254022 A1Published application
US 2016/0111402 A1Published application
US 10,707,188 B2This patent

From the US filing history. Foreign family members aren’t listed.