Compliant layer for wafer to wafer bonding

A system for bonding wafers, the system comprising:

• a first wafer holder to hold a first wafer comprising a compliant layer on a first surface thereof, wherein the compliant layer comprises a material stack comprising a metal layer on the first surface and a dielectric layer on the metal layer;
• a second wafer holder to hold a second wafer comprising a second surface, wherein the second wafer is to hold the second surface in close proximity of the first surface;
• a wafer deformer to deform a portion of the first or second wafer to contact the compliant layer to the second surface;
• a heating element to heat the compliant layer;
• and
• a controller controllably coupled to the wafer deformer and the heating element, the controller to provide a first signal to the wafer deformer to deform the first wafer and to subsequently provide a second signal to the heating element to heat the compliant layer to an elevated temperature greater than a temperature of the contacting of the compliant layer and the second surface.