Semiconductor device and method for manufacturing semiconductor device
AssigneeRohm Co., Ltd.
InventorsAkihiro Kimura, Takeshi Sunaga
Life of this patent
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Abstract
A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.
Claims15
A semiconductor device, comprising:
- a semiconductor element having an upper surface and a lower surface opposite to the upper surface;
- an electrode pad formed proximate the lower surface of the semiconductor element;
- a conductive projection member connected to the electrode pad;
- a first terminal having an upper surface, a lower surface and a side surface, the upper surface being connected to the conductive projection member;
- a fixing member formed on the upper surface of the first terminal;
- and
- a resin package that covers the semiconductor element and a part of the first terminal,
- wherein the lower surface and the side surface of the first terminal are exposed from the resin package, and the fixing member is formed around the conductive projection member in a manner such that the fixing member spreads widest at the upper surface of the first terminal and becomes narrower as the fixing member becomes closer to the semiconductor element,
- the resin package has an upper surface and a lower surface opposite to the upper surface thereof, and
- a distance between the lower surface of the resin package and the lower surface of the semiconductor element is greater than a distance between the upper surface of the semiconductor element and the upper surface of the resin package.
Dependencies are inferred from the claim text.