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US 10,707,184 B2Granted
Thermal bonding sheet and thermal bonding sheet with dicing tape
AssigneeNitto Denko Corporation
InventorsYuki Sugo, Nao Kamakura
Life of this patent
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Abstract
A thermal bonding sheet includes a layer, in which hardness of the layer after being heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes is in a range of 1.5 GPa to 10 GPa in measurement using a nanoindenter.
Claims5
A thermal bonding sheet comprising a layer serving as a sintered layer after being heated,
- wherein hardness of the layer after being heated under the following heating condition A is in a range of 1.5 GPa to 10 GPa in measurement using a nanoindenter:
- <Heating Condition A>
- the layer is heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes, and
- wherein the layer contains a thermally decomposable binder which is a solid at 23° C.
1 more element
A thermal bonding sheet comprising a layer serving as a sintered layer after being heated,
- wherein a modulus of elasticity of the layer after being heated under the following heating condition A is in a range of 30 GPa to 150 GPa in measurement using a nanoindenter:
- <Heating Condition A>
- the layer is heated at a heating rate of 1.5° C./sec from 80° C. to 300° C. under pressure of 10 MPa, and then held at 300° C. for 2.5 minutes, and
- wherein the layer contains a thermally decomposable binder which is a solid at 23° C.
1 more element
Dependencies are inferred from the claim text.