Wiring substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorsJunji Sato, Katsuya Fukase
Life of this patent
Estimating the term…
Abstract
A wiring substrate includes: a wiring member that includes a first surface and a second surface, the wiring member including a plurality of wiring layers between the first surface and the second surface; and a carrier that is bonded to the first surface via an adhesive and that includes a plurality of layers whose coefficients of thermal expansion are different from each other. A pitch of wires included in the plurality of wiring layers is narrower on the second surface side than on the first surface side. When being heated, a direction in which the wiring member tends to warp and a direction in which the carrier tends to warp are opposite.
Claims8
A wiring substrate comprising:
- a wiring member that includes a first surface and a second surface, the wiring member including a plurality of wiring layers between the first surface and the second surface;
- and
- a carrier that is bonded to the first surface via a first adhesive and that includes a plurality of layers whose coefficients of thermal expansion are different from each other, and one or more second adhesives,
- wherein the carrier has a configuration in which the plurality of layers and the one or more second adhesives are alternately layered,
- wherein a pitch of wires included in the plurality of wiring layers is narrower on the second surface side than on the first surface side, and
- wherein, with respect to the layers included in the carrier, the coefficients of thermal expansion decrease in accordance with proximity to the wiring member such that when being heated, a direction in which the wiring member tends to warp and a direction in which the carrier tends to warp are opposite.
A wiring substrate comprising:
- a wiring member that includes a first surface and a second surface, the wiring member including a plurality of wiring layers between the first surface and the second surface;
- a carrier that is bonded to the first surface via a first adhesive and that includes a plurality of layers whose coefficients of thermal expansion are different from each other, and one or more second adhesives,
- wherein the carrier has a configuration in which the plurality of layers and the one or more second adhesives are alternately layered,
- wherein a pitch of wires included in the plurality of wiring layers is narrower on the second surface side than on the first surface side, and
- wherein with respect to the layers included in the carrier, the coefficients of thermal expansion increase in accordance with proximity to the wiring member such that when being heated, a direction in which the wiring member tends to warp and a direction in which the carrier tends to warp are opposite.
Dependencies are inferred from the claim text.