Thermal interface material having different thicknesses in packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee
Life of this patent
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Abstract
A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
Claims20
A package comprising:
- an interposer comprising conductive traces therein;
- a first package component over and bonded to the interposer, wherein the first package component comprises:
- a first corner portion;
- a second corner portion;
- and
- an edge portion between the first corner portion and the second corner portion, wherein the edge portion extends to an edge of the first package component;
- an encapsulant encapsulating the first package component therein;
- a thermal interface material over and contacting the first package component, wherein the thermal interface material comprises:
- a first part having an additional portion overlapping the first corner portion of the first package component, wherein the additional portion of the first part extends into a recess that extends from a major top surface of the first package component into the first package component, and wherein the first part of the thermal interface material comprises a bottom surface forming:
- a first interface with the first corner portion of the first package component;
- and
- a second interface with the encapsulant, wherein the first interface is continuously connected to the second interface to form a continuous interface;
- and
- a second part having a bottom surface contacting the major top surface of the first package component.
A package comprising:
- a first package component;
- a second package component and a third package component over and bonded to the first package component, wherein each of the second package component and the third package component comprises:
- a first top surface;
- and
- a second top surface recessed lower than the first top surface to form a recess;
- and
- a filling material over and contacting both the second package component and the third package component, wherein the filling material comprises first portions extending into the recesses of the second package component and the third package component.
A package comprising:
- a package substrate;
- an interposer over and bonded to the package substrate;
- a device die over and bonded to the interposer;
- a metal cap comprising a top portion overlapping the device die;
- a thermal interface material between and contacting the device die and the metal cap, wherein the thermal interface material comprises:
- a top surface contacting a bottom surface of the top portion of the metal cap;
- a first bottom surface contacting a first portion of the device die;
- and
- a second bottom surface contacting a second portion of the device die, wherein the second bottom surface is lower than the first bottom surface, and wherein the first bottom surface is parallel to the second bottom surface, and the first bottom surface and the second bottom surface are planar;
- and
- an encapsulant encapsulating the device die therein, wherein the thermal interface material further comprises a third bottom surface contacting an additional top surface of the encapsulant.
Dependencies are inferred from the claim text.