Package structure and manufacturing method thereof

A package structure, comprising:

• at least one semiconductor die, having a front surface and a rear surface opposite to the front surface;
• a connecting film, located on the rear surface;
• a conductive plate, located on the connecting film;
• a molding compound, encapsulating the at least one semiconductor die and the connecting film, wherein a first surface of the molding compound is coplanar with the front surface of the at least one semiconductor die, and a second surface of the molding compound is coplanar with a third surface of the conductive plate, wherein along a stacking direction of the at least one semiconductor die, the connecting film and the conductive plate, the first surface is opposite to the second surface, the third surface is opposite to a fourth surface, and the fourth surface is closer to the at least one semiconductor die than the third surface is;
• a first redistribution circuit structure;
• located on the first surface of the molding compound;
• an encapsulant, located on the third surface of the conductive plate;
• and
• antenna elements, located on the encapsulation, wherein the encapsulation is located between the antenna elements and the third surface of the conductive plate.

A method of manufacturing a package structure, comprising:

• forming a conductive plate having a first surface, a second surface and a sidewall connecting the first surface and the second surface;
• disposing a semiconductor die on the second surface of the conductive plate;
• laterally encapsulating the semiconductor die in a molding compound, the sidewall and a portion of the second surface exposed by the semiconductor die being covered by the molding compound, and the first surface being coplanar to a surface of the molding compound;
• and
• forming antenna elements over the first surface of the conductive plate, the conductive plate is located between the semiconductor die and the conductive plate.