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US 10,707,168 B2Granted
Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
AssigneeIntel Corporation
InventorsAmruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama, Robert L. Sankman
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Abstract
An embedded multi-die interconnect bridge apparatus and method includes photolithographically formed interconnects coupled to laser-drilled interconnects. Several structures in the embedded multi-die interconnect bridge apparatus exhibit characteristic planarization during fabrication and assembly.
Claims14
A semiconductor package apparatus, comprising:
- a recess in a semiconductor package substrate, wherein the semiconductor package substrate includes a frusto-conical filled via that contacts a bond pad, wherein the bond pad contacts a right-cylindrical package pillar;
- a lamination that contacts the bond pad and the right-cylindrical package pillar;
- a package bond pad that contacts the lamination and the right-cylindrical opposite the bond pad;
- an electrical bump that contacts the package bond pad;
- and
- a patterned photoresist layer on the lamination and that partially exposes the package bond pad.
3 more elements
Dependencies are inferred from the claim text.