Cavity wall structure for semiconductor packaging

A semiconductor package comprising:

• a multi-layer package substrate having a first major surface and a second major surface opposite to the first major surface, wherein the package substrate comprises a recess region extending downwardly from the first major surface of the package substrate, wherein the recess region is defined with a die region and a non-die region surrounding the die region;
• a semiconductor die, wherein the semiconductor die is disposed in the die region within the recess region;
• wire bonds within the recess region, wherein the wire bonds electrically connect the semiconductor die to input/output (I/O) terminals disposed adjacent the second major surface of the package substrate;
• a dam structure disposed within the recess region, wherein the dam structure surrounds the semiconductor die and extends upwardly to a height below the first major surface of the package substrate;
• an encapsulant disposed within the recess region, wherein the encapsulant is surrounded by the dam structure, wherein the encapsulant extends upwardly to a height below the height of the dam structure;
• and
• a package lid to the package substrate.

A semiconductor package comprising:

• a package substrate having a first major surface and a second major surface opposite to the first major surface, wherein the package substrate comprises a recess region extending downwardly from the first major surface of the substrate, wherein the recess region is defined with a die region and a non-die region surrounding the die region;
• a semiconductor die, wherein the semiconductor die is disposed in the die region within the recess region;
• a dam structure disposed within the recess region, wherein the dam structure surrounds the semiconductor die and extends upwardly to a height below the first major surface of the package substrate;
• an encapsulant disposed within the recess region, wherein the encapsulant is surrounded by the dam structure, wherein the encapsulant extends upwardly to a height below the height of the dam structure;
• and
• a package lid to the package substrate, wherein the package lid encloses the recess region.