Semiconductor device, chip module, and semiconductor module

A chip module that includes a module substrate in a rectangular plate shape, on an upper surface of which at least one semiconductor chip is supported and fixed, and a plurality of connection terminals disposed planarly along a lower surface of the module substrate and electrically connected to the semiconductor chip, the semiconductor chip including a package substrate and at least one semiconductor die supported by the package substrate, wherein:

• the semiconductor chip has a plurality of chip terminals disposed planarly along a supported surface supported by the module substrate and electrically connected to the module substrate,
• the plurality of chip terminals include a plurality of chip power supply terminals through which power is supplied to the semiconductor chip,
• the plurality of chip power supply terminals are disposed on an inner side with respect to an outer edge of an arrangement region in which the plurality of chip terminals are disposed planarly,
• the semiconductor chip is mounted on the module substrate,
• an arrangement of the plurality of chip terminals and an arrangement of the plurality of connection terminals are changed in the module substrate,
• the plurality of connection terminals are arranged in a plurality of rectangular rings along sides of the module substrate, and the plurality of connection terminals include an inner peripheral-side terminal group arranged on a center side of the module substrate and an outer peripheral-side terminal group arranged on an outer peripheral side with respect to the inner peripheral-side terminal group,
• the inner peripheral-side terminal group includes an inner peripheral-side power supply terminal group connected to a power supply terminal of the semiconductor chip,
• the outer peripheral-side terminal group includes an outer peripheral-side power supply terminal group of the same system as at least a part of the inner peripheral-side power supply terminal group,
• the inner peripheral-side power supply terminal group is disposed at a position at which at least a part of the inner peripheral-side power supply terminal group overlaps the semiconductor chip as seen in a direction that is orthogonal to a plate surface of the module substrate, and
• the outer peripheral-side power supply terminal group is arranged so as to be continuous from the inner peripheral-side power supply terminal group to an outermost peripheral terminal of the outer peripheral-side terminal group.

A semiconductor device comprising:

• a semiconductor module that includes a support substrate in a rectangular plate shape, on an upper surface of which one or more semiconductor elements are supported and fixed, and a plurality of connection terminals disposed planarly along a lower surface of the support substrate and electrically connected to the semiconductor elements;
• and
• a main substrate which has a plurality of wiring layers and on which the semiconductor module is surface-mounted via the plurality of connection terminals, the main substrate being formed with a plurality of through holes that penetrate the main substrate and that enable the plurality of wiring layers to be electrically connected to each other, wherein
• the plurality of connection terminals are arranged in a plurality of rectangular rings along sides of the support substrate, and the plurality of connection terminals include an inner peripheral-side terminal group arranged on a center side of the support substrate and an outer peripheral-side terminal group arranged on an outer peripheral side with respect to the inner peripheral-side terminal group,
• the inner peripheral-side terminal group includes an inner peripheral-side power supply terminal group through which power is supplied to a target semiconductor element which is one of the semiconductor elements,
• the outer peripheral-side terminal group includes an outer peripheral-side power supply terminal group of the same system as at least a part of the inner peripheral-side power supply terminal group,
• the inner peripheral-side power supply terminal group is disposed at a position at which at least a part of the inner peripheral-side power supply terminal group overlaps the target semiconductor element as seen in a direction that is orthogonal to a plate surface of the support substrate,
• the outer peripheral-side power supply terminal group is arranged so as to be continuous from the inner peripheral-side power supply terminal group to an outermost peripheral terminal of the outer peripheral-side terminal group,
• the main substrate has a surface layer power supply path, through which power is supplied to the target semiconductor element via the inner peripheral-side power supply terminal group and the outer peripheral-side power supply terminal group, in a surface layer wiring layer on which the semiconductor module is mounted, and
• the surface layer power supply path overlaps the inner peripheral-side power supply terminal group and the outer peripheral-side power supply terminal group as seen in an orthogonal direction that is orthogonal to a substrate surface of the main substrate with the semiconductor module mounted on the main substrate, and is formed continuously so as to extend from a position at which the surface layer power supply path is connected to the inner peripheral-side power supply terminal group toward an outer peripheral side of the main substrate.