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US 10,707,156 B2Granted
Electronic device
AssigneesKatoh Electric Co., Ltd., Torex Semiconductor Ltd.
InventorsShinya Sato, Yuki Yasuda, Yojiro Shiina
Life of this patent
Estimating the term…
Abstract
An electronic device comprises a semiconductor chip, an accommodating part that accommodates the semiconductor chip, a plurality of terminals that are provided along a first side of a first surface and along a second side opposite to the first side with respect to the semiconductor chip, the plurality of terminals being electrically connected to the semiconductor chip and being exposed on the rectangular first surface of the accommodating part, and a plurality of conductive members that penetrate from the first surface of the accommodating part to the second surface opposite to the first surface.
Claims8
An electronic device comprising:
- a semiconductor chip;
- an accommodating part that accommodates the semiconductor chip;
- a plurality of terminals that are provided along a first side of a first surface and along a second side opposite to the first side with respect to the semiconductor chip, the plurality of terminals being electrically connected to the semiconductor chip and being exposed on the rectangular first surface of the accommodating part, the rectangular first surface being the side opposite to the side of the accommodating part where the semiconductor chip is placed;
- and
- a plurality of conductive members that penetrate from the first surface of the accommodating part to the second surface opposite to the first surface, the plurality of conductive members functioning as lands for mounting an electronic component, wherein
- the plurality of conductive members are provided at positions closer to a third side and a fourth side where the plurality of terminals electrically connected to the semiconductor chip are not provided than to the positions where the plurality of terminals are provided, the third side and the fourth side being orthogonal to the first side, wherein
- a first conductive member of the plurality of conductive members includes:
- a first area whose cross-sectional area is a first size and includes a portion exposed on the first surface;
- and
- a second area whose cross-sectional area is a second size smaller than the first size and includes a portion exposed on the second surface, and
- a second conductive member of the plurality of conductive members has the cross-sectional area whose size is the same from a side exposing on the first surface to a side exposing on the second surface.
8 more elements
An electronic device comprising:
- a semiconductor chip;
- an accommodating part that accommodates the semiconductor chip;
- a plurality of terminals that are provided along a first side of a first surface and along a second side opposite to the first side with respect to the semiconductor chip, the plurality of terminals being electrically connected to the semiconductor chip and being exposed on the rectangular first surface of the accommodating part, the rectangular first surface being the side opposite to the side of the accommodating part where the semiconductor chip is placed;
- and
- a plurality of conductive members that penetrate from the first surface of the accommodating part to the second surface opposite to the first surface, the plurality of conductive members functioning as lands for mounting an electronic component, wherein
- the plurality of conductive members are provided at positions closer to a third side and a fourth side where the plurality of terminals electrically connected to the semiconductor chip are not provided than to the positions where the plurality of terminals are provided, the third side and the fourth side being orthogonal to the first side, wherein
- a first conductive member of the plurality of conductive members is exposed on a side surface of the third side near the first surface and unexposed on a side surface of the third side near the second surface, and
- a second conductive member of the plurality of conductive members is provided at a position closer to the fourth side than to the third side and unexposed on a side surface of the fourth side.
5 more elements
An electronic device comprising:
- a semiconductor chip;
- an accommodating part that accommodates the semiconductor chip;
- a plurality of terminals that are provided along a first side of a first surface and along a second side opposite to the first side with respect to the semiconductor chip, the plurality of terminals being electrically connected to the semiconductor chip and being exposed on the rectangular first surface of the accommodating part, the rectangular first surface being the side opposite to the side of the accommodating part where the semiconductor chip is placed;
- and
- a plurality of conductive members that penetrate from the first surface of the accommodating part to the second surface opposite to the first surface, the plurality of conductive members functioning as lands for mounting an electronic component, wherein
- the plurality of conductive members are provided at positions closer to a third side and a fourth side where the plurality of terminals electrically connected to the semiconductor chip are not provided than to the positions where the plurality of terminals are provided, the third side and the fourth side being orthogonal to the first side, wherein
- a first two conductive members of the plurality of conductive members are provided on the third side, each of the first two conductive members being provided on opposite sides with respect to a first separating plate of a die pad located at a center line between the first side and the second side;
- and
- a second two conductive members of the plurality of conductive members are provided on the fourth side, each of the second two conductive members being provided on opposite sides with respect to a second separating plate of the die pad located at the center line, wherein
- the first separating plate and the second separating plate are thinner than a plate in a region where a semiconductor is provided.
7 more elements
Dependencies are inferred from the claim text.