Semiconductor device and method for manufacturing the same
AssigneeRohm Co., Ltd.
InventorsMasato Ikeda, Motoharu Haga
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes leads, a semiconductor element and a sealing resin covering the leads and the semiconductor element. The sealing resin includes an obverse surface, a reverse surface, and an end surface between the obverse surface and the reverse surface. The leads include a peripheral lead with a reverse surface exposed from the reverse surface of the resin and with an outer end surface exposed from the end surface of the resin. The outer end surface is located inward from the end surface of the resin. The sealing resin includes an interior top surface connected to its end surface and the outer end surface of the lead. The interior top surface and the reverse surface of the resin face in the same direction.
Claims18
A semiconductor device comprising:
- a lead set including a plurality of leads;
- a semiconductor element;
- and
- a sealing resin covering at least a part of the lead set and at least a part of the semiconductor element,
- wherein the sealing resin includes a resin obverse surface and a resin reverse surface opposite to each other in a thickness direction, and a resin end surface located between the resin obverse surface and the resin reverse surface and extending along the thickness direction,
- the lead set comprises a peripheral lead including a lead reverse surface exposed from the resin reverse surface and a lead outer end surface exposed from the resin end surface,
- the lead outer end surface includes a single flat surface region, an entirety of the single flat surface region being located inward from the resin end surface in a direction perpendicular to the thickness direction,
- the sealing resin includes a resin interior top surface connected to the resin end surface and the lead outer end surface, and the resin interior top surface and the resin reverse surface face in a same directiom,
- the single flat surface region of the lead outer end surface has an upper edge held in contact with the resin interior top surface.
A method for manufacturing a semiconductor device, the method comprising:
- mounting a semiconductor element on a lead frame including a set of leads,
- forming a resin body to cover at least a part of the lead frame and at least a part of the semiconductor element,
- forming a plating layer on a portion of the lead frame that is exposed from the resin body,
- cutting the lead frame and the resin body to form a sealing resin and a set of leads, the sealing resin including a resin end surface, the set of leads including a peripheral lead having a lead outer end surface exposed from the resin end surface, and
- performing an etching process to etch away the peripheral lead to a larger extent than the sealing resin and the plating layer such that the lead outer end surface is recessed relative to the resin end surface,
- wherein the lead outer end surface includes a flat surface region that is parallel to the resin end surface, and an entirety of the flat surface region is located inward from the resin end surface.
Dependencies are inferred from the claim text.