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US 10,707,153 B2Granted
Semiconductor device having die pad
AssigneeSTMicroelectronics S.r.l.
InventorFederico Giovanni Ziglioli
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes: one or more semiconductor dice, a die pad supporting the semiconductor die or dice, a package molded onto the semiconductor die or dice supported by said die pad, wherein the die pad is exposed at the surface of the package, and the exposed die pad with an etched pattern therein to form at least one electrical contact land in the die pad.
Claims10
A semiconductor device, comprising:
- at least one semiconductor die,
- a plurality of leads,
- a single, continuous die pad supporting the at least one semiconductor die at a first surface, the plurality of leads being at a first side of the die pad, the die pad including a cutout at the first side,
- at least one electrical contact land that is electrically isolated and separated from the die pad and defined at least in part by the cutout at the first side of the die pad, the at least one electrical contact land being separated from the die pad by the cutout, wherein a surface of the at least one electrical contact land, a surface of the die pad, and the cutout together form a rectangular shape in a plane, wherein at least one lead of the plurality of leads and the at least one electrical contact land are formed from a single piece,
- a capacitor electrically and mechanically coupled to the die pad and the at least one electrical contact land, and
- a package around the at least one semiconductor die and the capacitor.
3 more elements
A semiconductor package, comprising:
- a plurality of leads;
- a die pad including a first portion and a second portion, the second portion being physically separated and electrically isolated from the first portion by a cutout between the first and second portions at a first edge of the die pad, wherein the first portion is single and continuous, wherein the first portion, the second portion, and the cutout form a rectangular shape, the plurality of leads being at the edge of the die pad, the first portion of the die pad being formed as a single piece with a first lead of the plurality of leads;
- a semiconductor die coupled to a first surface of a second portion of the die pad;
- a capacitor coupled to the die pad, wherein a first terminal of the capacitor is electrically and mechanically coupled to the first portion of the die pad, wherein a second terminal of the capacitor is electrically and mechanically coupled to the second portion of the die pad;
- and
- packaging material around the semiconductor die, a second surface of the die pad forming an outer surface of the semiconductor package, the second surface of the die pad being opposite the first surface.
3 more elements
Dependencies are inferred from the claim text.