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US 10,707,147 B2Granted
Clip for semiconductor package
AssigneeSemiconductor Components Industries, LLC
InventorAriel Sotomayor Tan
Life of this patent
Estimating the term…
Abstract
Implementations of a clip may include a die attach portion including at least one protrusion extending from the die attach portion and a lead frame alignment portion including at least one alignment feature. The at least one alignment feature may be configured to couple into at least one hole in a lead frame thereby aligning the clip with the lead frame. The at least one protrusion may be configured to couple into at least one recess in the die.
Claims20
A clip comprising:
- a die attach portion comprising at least one protrusion extending from the die attach portion;
- and
- a lead frame alignment portion comprising at least one alignment feature;
- wherein the at least one protrusion is configured to couple into at least one recess in the die.
1 more element
A clip comprising:
- a die attach portion configured to directly couple within a recess comprised in a die;
- and
- a lead frame alignment portion configured to directly couple to a lead frame;
- wherein the lead frame alignment portion is configured to fixedly couple the clip to the lead frame in a desired physical arrangement;
- and
- wherein the die attach portion is configured to fixedly couple the clip to the die in a desired physical arrangement.
3 more elements
A semiconductor package comprising:
- a die comprising at least one recess in a first side of the die;
- a lead frame coupled to the first side of the die;
- and
- a clip comprising;
- a die attach portion comprising at least one protrusion extending from the die attach portion;
- and
- a lead frame alignment portion comprising at least one alignment feature and configured to couple to the lead frame;
- wherein the at least one protrusion is configured to couple into the at least one recess in the die.
5 more elements
Dependencies are inferred from the claim text.