High density multi-component packages

An electronic circuit comprising:

• a high density multi-component package comprising:
• at least two electronic components wherein each electronic component comprises a first external termination and a second external termination;
• an interposer between adjacent electronic components wherein said interposer is selected from an active interposer and a mechanical interposer,
• wherein an active interposer comprises active pads, mechanical pads, and a substrate, each active pad is in electrical contact with a corresponding active pad on an opposite side of the substrate, each mechanical pad is not in electrical contact with a corresponding mechanical pad on the opposite side of the substrate, wherein for at least one of said adjacent electronic components, the first external termination is electrically connected by one of said two of said active pads opposing each other on the substrate, and the second external termination is in contact with and adhered to a respective one of two of said mechanical pads but not electrically connected to the other of said two mechanical pads, said two mechanical pads opposing each other on the substrate,
• wherein a mechanical interposer comprises a substrate and mechanical pads and does not have an active pad, and
• wherein said adjacent electronic components are connected serially;
• a circuit board comprising traces wherein at least one trace of said traces is an active trace and at least one trace of said traces is a mechanical trace;
• wherein at least one first external termination of at least one first electronic component of said electronic components is in electrical contact with at least one said active trace;
• and
• wherein at least one second external termination of at least one second electronic component of said electronic components is in electrical contact with at least one said mechanical trace;
• and
• a circuit substrate, wherein said circuit substrate comprises at least two circuit traces.