Back to results
US 10,707,144 B2Granted
Thermal boundary control
AssigneeRaytheon Company
InventorThomas P. Sprafke
Life of this patent
Estimating the term…
Abstract
A method of creating thermal boundaries in a substrate is provided. The method includes forming the substrate with first and second sections to be in direct thermal communication with first and second thermal elements, respectively, machining, in the substrate, first and second cavities for defining a third section of the substrate between the first and second sections and disposing a material having a characteristic thermal conductivity that is substantially less than that of the ceramic in the first and second cavities.
Claims13
A substrate with thermal boundaries, comprising:
- a substrate formed with first and second sections to be in direct thermal communication with first and second thermal elements, respectively,
- the substrate being formed to define first and second cavities and the first and second cavities defining a third section of the substrate between the first and second sections;
- and
- material disposed in the first and second cavities and having a characteristic thermal conductivity that is substantially less than that of a ceramic of the substrate.
1 more element
An assembly with thermal isolation, comprising:
- first and second thermal elements at differing temperatures;
- a substrate formed with first and second sections in direct thermal communication with the first and second thermal elements, respectively,
- the substrate being formed to define first and second cavities and the first and second cavities define a third section of the substrate between the first and second sections;
- and
- material disposed in the first and second cavities and having a characteristic thermal conductivity that is substantially less than that of a ceramic of the substrate.
2 more elements
Dependencies are inferred from the claim text.