Semiconductor package and method manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Cheng Hsu, Shin-Puu Jeng
Life of this patent
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Abstract
A semiconductor package including at least one integrated circuit component and a glue material is provided. The at least one integrated circuit component has a top surface with conductive terminals and a backside surface opposite to the top surface. The glue material encapsulates the at least one integrated circuit component, wherein a first lateral thickness of the glue material is smaller than a second lateral thickness of the glue material, the second lateral thickness is parallel to the first lateral thickness, and the first lateral thickness is substantially coplanar with the top surface.
Claims20
A semiconductor package, comprising:
- at least one integrated circuit component having a top surface with conductive terminals and a backside surface opposite to the top surface;
- a glue material encapsulating the at least one integrated circuit component, wherein a first lateral thickness of the glue material is smaller than a second lateral thickness of the glue material, the second lateral thickness is parallel to the first lateral thickness, and the first lateral thickness is substantially coplanar with the top surface;
- and
- a plurality of vertical interconnect structures located aside of the at least one integrated circuit component, wherein the end surfaces of the plurality of vertical interconnect structures are substantially coplanar to the top surface.
A semiconductor package, comprising:
- a first semiconductor device, having a first surface with first conductive terminals;
- a second semiconductor device, located aside of the first semiconductor device and having a second surface with second conductive terminals;
- an insulating encapsulation, comprising:
- a glue material, encapsulating the first semiconductor device and the second semiconductor device and located therebetween;
- and
- a molding compound, encapsulating the glue material and separated from the first semiconductor device and the second semiconductor device through the glue material;
- and
- a redistribution circuit structure, located on the first semiconductor device and the second semiconductor device, wherein the redistribution circuit structure is directly connected to the first surface of the first semiconductor device, the second surface of the second semiconductor device, a third surface of the glue material, and a fourth surface of the molding compound,
- wherein the glue material has a fifth surface opposite to the third surface, and a size of the fifth surface is greater than a size of the third surface.
A semiconductor package, comprising:
- a first insulating encapsulation having an area of a first surface smaller than an area of a second surface opposite to the first surface;
- at least one first integrated circuit component having a third surface with conductive terminals and embedded in the first insulating encapsulation, wherein the third surface is substantially coplanar to the first surface;
- conductive pillars located aside of the at least one first integrated circuit component;
- a redistribution circuit structure located on the at least one first integrated circuit component and the conductive pillars, wherein the redistribution circuit structure is directly connected to the first surface of the first insulating encapsulation, the third surface of the at least one first integrated circuit component, and end surfaces of the conductive pillars;
- and
- a second insulating encapsulation encapsulating the first insulating encapsulation and the conductive pillars, and physically separated from the at least one first integrated circuit component through the first insulating encapsulation, wherein a sidewall of the first insulating encapsulation is covered by and in contact with the second insulating encapsulation.
Dependencies are inferred from the claim text.