Semiconductor device and manufacturing method thereof
AssigneeMitsubishi Electric Corporation
InventorsNaoki Yoshimatsu, Osamu Usui, Yuji Imoto
Life of this patent
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Abstract
First and second electrodes (12,13) are provided on an upper surface of the semiconductor chip (9) and spaced apart from each other. A wiring member (15) includes a first joint (15a) bonded to the first electrode (12) and a second joint (15b) bonded to the second electrode (13). Resin (2) seals the semiconductor chip (9), the first and second electrodes (12,13) and the wiring member (15). A hole (18) extending through the wiring member (15) up and down is provided between the first joint (15a) and the second joint (15b).
Claims7
A semiconductor device comprising:
- a semiconductor chip;
- first and second electrodes provided on an upper surface of the semiconductor chip and spaced apart from each other;
- a wiring member including a first joint bonded to the first electrode and a second joint bonded to the second electrode;
- and
- resin sealing the semiconductor chip, the first and second electrodes and the wiring member,
- wherein a hole extending through the wiring member up and down is provided between the first joint and the second joint.
A manufacturing method of a semiconductor device comprising:
- forming a hole extending through a wiring member up and down between a first joint and a second joint of the wiring member;
- bonding first and second electrodes, which are provided on an upper surface of a semiconductor chip and spaced apart from each other, to the first and second joints of the wiring member respectively;
- and
- injecting resin downward of the wiring member through the hole to seal the semiconductor chip, the first and second emitter electrodes, and the wiring member.
Dependencies are inferred from the claim text.