US 10,707,111 B2 · Wafer level flat no-lead semiconductor packages and methods of manufacture

Abstract

Methods of manufacturing semiconductor packages. Implementations may include: providing a substrate with a first side, a second side, and a thickness; forming a plurality of pads on the first side of the substrate; and applying die attach material to the plurality of pads. The method may include bonding a wafer including a plurality of semiconductor die to the substrate at one or more die pads included in each die. The method may also include singulating the plurality of semiconductor die, overmolding the plurality of semiconductor die and the first side of the substrate with an overmold material, and removing the substrate to expose the plurality of pads and to form a plurality of semiconductor packages coupled together through the overmold material. The method also may include singulating the plurality of semiconductor packages to separate them.

Claims20

Dependent claims

A method of manufacturing a semiconductor package, the method comprising:

providing a wafer comprising a plurality of semiconductor die, each of the plurality of semiconductor die comprising one or more die pads;
forming a plurality of package pads, each package pad coupled to each of the one or more die pads;
mounting the wafer to a wafer singulation tape;
singulating the plurality of semiconductor die;
one of overmolding or underfilling the plurality of semiconductor die coupled to the wafer singulation tape to form a plurality of semiconductor packages;
transferring the plurality of semiconductor packages to a package singulation tape;
singulating the plurality of semiconductor packages coupled to the package singulation tape to separate each of the plurality of semiconductor packages from each other.

4 more elements

Dependencies are inferred from the claim text.

Wafer level flat no-lead semiconductor packages and methods of manufacture

Life of this patent

Wafer level flat no-lead semiconductor packages and methods of manufacture

Life of this patent

Abstract

Claims20