Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication

A wafer carrier purge apparatus comprising:

• a purge plate adapted for insertion into a carrier storage position, wherein the purge plate comprises:
• a body having a contact surface;
• a first protrusion extending outward from the body;
• a second protrusion extending outward from the body and substantially aligned with the first protrusion;
• a fastening feature shaped for attachment of the purge plate to the carrier storage position;
• a gas nozzle on the first protrusion and adapted to contact an inlet port of a wafer carrier for introducing gas into the wafer carrier;
• a vacuum nozzle on the second protrusion and adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier,
• an alignment feature located on the contact surface of the body of the purge plate, wherein the alignment feature is linearly between the gas nozzle and the vacuum nozzle;
• a presence sensor mounted on the contact surface of the body between the fastening feature and the alignment feature, wherein the presence sensor detects the carrier storage position;
• and
• a pressure sensor oriented perpendicularly with respect to the fastening feature, the presence sensor, and the alignment feature, the pressure sensor configured to monitor the flow of gas to the gas nozzle and to detect whether the gas port is aligned with the inlet port of the wafer carrier,
• wherein the purge plate is separate and removable from the carrier storage position.

A wafer carrier purge apparatus comprising:

• a purge plate having a one piece construction adapted for insertion into a carrier storage position, wherein the purge plate comprises:
• a body having a contact surface;
• a first protrusion extending outward from the body;
• a second protrusion extending outward from the body and substantially aligned with the first protrusion;
• a gas nozzle on the first protrusion for introducing gas into the wafer carrier;
• a gas port for receiving a gas flow in fluid communication with the gas nozzle and adapted to contact an inlet port of a wafer carrier;
• a vacuum port on the second protrusion;
• a vacuum nozzle for removing gas from the wafer carrier and in fluid communication with the vacuum port;
• an alignment feature located on the contact surface of the body of the purge plate, wherein the alignment feature is linearly between the gas nozzle and the vacuum nozzle;
• and
• a channel separating the gas nozzle and vacuum nozzle, wherein the channel extends across the body between a first end and a second end, the second end is between the first protrusion and the second protrusion of the body, and wherein the second end is oriented perpendicularly with respect to the first end,
• wherein the purge plate is separate and removable from the carriage storage position.