Selective shape memory alloy pick-up head
AssigneeFacebook Technologies, LLC
InventorPooya Saketi
Life of this patent
Estimating the term…
Abstract
A pick-up head array with shape memory alloy (SMA) pick-up heads is used for selective pick-up and placement of semiconductor devices. In response to the application of heat, the SMA body portions of one or more of the pick-up heads of the pick-up head array transition from a shortened state to an extended state. In the extended state, the one or more pick-up heads are able to attach to one or more LEDs on a carrier substrate. The LEDs are removed from the carrier substrate and placed onto a target substrate by the pick-up head array. Heat may be applied to the one or more pick-up heads to bond the LEDs to the target substrate. The LEDs are then detached from the pick-up head array, and heat may be removed from the one or more pick-up heads to return them to their rest state.
Claims18
A method comprising:
- positioning an array of pick-up heads over light emitting diodes (LEDs) on a carrier substrate, each of the pick-up heads of the array including:
- a shape memory alloy (SMA) body portion that transitions from a shortened state to an extended state responsive to application of heat;
- and
- a pick-up surface at an end of the SMA body portion;
- and
- selectively applying heat to one or more pick-up heads of the array, the application of heat causing the SMA body portion of each of the one or more pick-up heads to transition to the extended state to attach a respective LED of the LEDs on the carrier substrate with a pick-up surface of the pick-up head, wherein the pick-up surface of each of the one or more pick-up heads or the respective LED includes an elastomeric layer that provides adhesive attachment between the pick-up surface and the respective LED.
A system, comprising:
- an array of pick-up heads, each of the pick-up heads of the array including:
- a shape memory alloy (SMA) body portion that transitions from a shortened state to an extended state responsive to application of heat;
- and
- a pick-up surface at an end of the SMA body portion, the pick-up surface including an elastomeric layer that provides adhesive attachment.
An electronic display manufactured by a process, comprising:
- positioning an array of pick-up heads over light emitting diodes (LEDs) on a carrier substrate, each of the pick-up heads of the array including:
- a shape memory alloy (SMA) body portion that transitions from a shortened state to an extended state responsive to application of heat;
- and
- a pick-up surface at an end of the SMA body portion;
- selectively applying heat to one or more pick-up heads of the array, the application of heat causing the SMA body portion of each of the one or more pick-up heads to transition to the extended state to attach a respective LED of the LEDs on the carrier substrate with a pick-up surface of the pick-up head, wherein the pick-up surface of each of the one or more pick-up heads or the respective LED includes an elastomeric layer that provides adhesive attachment between the pick-up surface and the respective LED;
- and
- with the one or more LEDs attached to the one or more pick-up heads, placing the one or more LEDs on a display substrate of the electronic display.
Dependencies are inferred from the claim text.