Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsHiromitsu Namba, Fitrianto, Yoichi Tokunaga, Yoshifumi Amano
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AssigneeTokyo Electron Limited
InventorsHiromitsu Namba, Fitrianto, Yoichi Tokunaga, Yoshifumi Amano
Estimating the term…
A substrate processing apparatus includes a substrate holding unit configured to hold a substrate; a first processing liquid nozzle configured to supply a first processing liquid to a peripheral portion of the substrate; a second processing liquid nozzle configured to supply a second processing liquid, the temperature of which is lower than that of the first processing liquid, to the peripheral portion of the substrate; a first gas supply port configured to supply a first gas at a first temperature to a first gas supplied place on the peripheral portion of the substrate; and a second gas supply port configured to supply a second gas at a second temperature lower than the first temperature to a place closer to the center in the radial direction as compared to the first gas supplied place with respect to the substrate.
A substrate processing apparatus comprising:
Dependencies are inferred from the claim text.