Fuse element, fuse device, and heat-generator-integrated fuse device
AssigneeDexerials Corporation
InventorYoshihiro Yoneda
Life of this patent
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Abstract
A fuse device and a fuse element having excellent rapid blowout properties and excellent insulation properties after blowout even in a size-reduced fuse device are provided. A fuse element constitutes a current path of a fuse device and blows out due to self-generated heat when a rating-exceeding current flows, a length W in a width direction perpendicular to a conduction direction being greater than a total length L in the conduction direction in the fuse element. In particular, the fuse element includes a low melting point metal layer and a high melting point metal layer, the low melting point metal layer eroding the high melting point metal layer when current flows to cause blowout.
Claims46
A fuse element which constitutes a current path of a fuse device, the fuse element comprising:
- a blowout portion comprising:
- a low melting point metal layer having a film thickness of 30 μm or more;
- and
- a high melting point metal layer laminated on the low melting point metal layer, the high melting point metal layer having a film thickness of 3 μm or more,
- wherein a width (W) of the blowout portion in a width direction perpendicular to a conduction direction is greater than a total length (L) of the blowout portion in the conduction direction,
- the fuse element is connected between two electrodes on a circuit board and connected onto the electrodes by a solder at a reflow temperature of the solder,
- a melting point of the low melting point metal layer and a melting point of the solder are equal to or lower than 260° C.,
- the low melting point metal layer and the solder are melted at the reflow temperature of the solder, and
- the fuse element is configured to blow out due to self-generated heat when a rating-exceeding current flows therethrough.
A fuse device, comprising:
- a fuse element which constitutes a current path and is configured to blow out due to self-generated heat when a rating-exceeding current flows therethrough, the fuse element comprising:
- a blowout portion comprising:
- a low melting point metal layer having a film thickness of 30 μm or more;
- and
- a high melting point metal layer laminated on the low melting point metal layer, the high melting point metal layer having a film thickness of 3 μm or more,
- wherein a width (W) of the blowout portion in a width direction perpendicular to a conduction direction is greater than a total length (L) of the blowout portion in the conduction direction,
- the fuse element is connected between first and second electrodes on an insulating substrate and connected onto the first and second electrodes by a solder at a reflow temperature of the solder,
- a melting point of the low melting point metal layer and a melting point of the solder are equal to or lower than 260° C., and
- the low melting point metal layer and the solder are melted at the reflow temperature of the solder.
A fuse element which constitutes a current path of a fuse device, the fuse element comprising:
- a blowout portion comprising a low melting point metal layer;
- and
- a terminal serving as an external connection terminal of the fuse device,
- wherein a width (W) of the blowout portion in a width direction perpendicular to a conduction direction is greater than a total length (L) of the blowout portion in the conduction direction,
- the fuse element is connected between two electrodes on a circuit board and connected onto the electrodes by a solder at a reflow temperature of the solder,
- a melting point of the low melting point metal layer and a melting point of the solder are equal to or lower than 260° C.,
- the low melting point metal layer and the solder are melted at the reflow temperature of the solder, and
- the fuse element is configured to blow out due to self-generated heat when a rating-exceeding current flows through the therethrough.
Dependencies are inferred from the claim text.