Method of manufacturing laminated electronic component

A method of manufacturing a laminated electronic component having a circuit element formed in an element body of pluralities of laminated magnetic material layers and conductor patterns with the conductor patterns between the laminated magnetic material layers, the method comprising:

• forming a collective laminated body including a plurality of element bodies having circuit elements formed therein by alternately laminating pluralities of magnetic material layers and conductor patterns;
• forming a plurality of external terminals on one of surfaces of the collective laminated body orthogonal to a lamination direction;
• forming a disappearing layer covering the external terminals and caused to disappear by heat treatment on the surface of the collective laminated body on which the plurality of external terminals is formed;
• cutting and dividing the collective laminated body having the disappearing layer formed thereon along the lamination direction into each of the element bodies, each of the element bodies including a portion of the external terminals and including a circuit element;
• applying an insulator precursor to a surface of at least one of the element bodies;
• and
• forming a laminated electronic component by applying a heat treatment to the at least one element body to which the insulator precursor is applied, wherein
• the circuit element of the laminated electronic component has a first end portion that is a lead-out end of the circuit element close to a bottom surface of the element body on which the portions of the external terminals are disposed and a second end portion that is a lead-out end of the circuit element distant from the bottom surface of the at least one element body, wherein
• the first end portion is connected to a first external terminal disposed on the bottom surface of the at least one element body while a second end portion is connected to the second external terminal disposed on the bottom surface of the at least one element body via a conductor disposed on a side surface of the at least one element body with a surface thereof at least partially exposed, and wherein
• the surface of the conductor exposed on the side surface of the at least one element body is covered with an insulator film that is a heat-treated object of the insulator precursor.