Thin film-type inductor
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJoung Gul Ryu, Byeong Cheol Moon, Jin Hyuk Jang
Life of this patent
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Abstract
A thin film-type inductor includes a body including a support member having a through-hole filled with a magnetic material and a via hole, a coil disposed on at least one side of the support member and including a plurality of coil patterns, and a magnetic material sealing the support member and the coil. Each of the coil patterns includes a first conductor layer, a second conductor layer, and a third conductor layer. The second conductor layer is disposed on a side surface of the via hole, and is disposed to seal a lower surface of the via hole.
Claims17
A thin film-type inductor, comprising
- a body comprising
- a support member having a through-hole filled with a magnetic material and a via hole;
- a coil disposed on at least one side of the support member and including a plurality of coil patterns, each of the coil patterns comprising a first conductor layer, a second conductor layer, and a third conductor layer;
- and
- a magnetic material sealing the support member and the coil, and
- an external electrode disposed on an external surface of the body and connected to the coil,
- wherein the first conductor layer is a base conductor layer of the second conductor layer and the third conductor layer, and is provided to have an overall spiral shape, and
- the second conductor layer is disposed on a side surface of the via hole, and is disposed to seal a lower surface of the via hole,
- wherein the second conductor layer comprises
- a first portion disposed between the first conductor layer and the third conductor layer, a second portion disposed between the upper surface of the support member and the third conductor layer, and a third portion in contact with the support member and disposed to cover the lower surface of the via hole, and
- a first connection portion in contact with side surfaces of the first conductor layer and connecting the first portion and the second portion, a second connection portion in contact with inner surfaces of the support member and connecting the second portion and the third portion, and
- the first connection portion is disposed on side surfaces of the via hole.
Dependencies are inferred from the claim text.