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US 10,706,985 B2Granted
Aluminum foil, electronic component wiring board manufactured using the same, and method of manufacturing aluminum foil
AssigneeToyo Aluminium Kabushiki Kaisha
InventorsSotaro Akiyama, Yoshitaka Nishio
Life of this patent
Estimating the term…
Abstract
An aluminum foil having a high adhesiveness to solder and containing at least one of Sn and Bi, in which a ratio of a total mass of Sn and Bi to a total mass of the aluminum foil is 0.0075 mass % or more and 15 mass % or less.
Claims5
Aluminum foil consisting of pure aluminum and at least one of Sn and Bi,
- a ratio of a total mass of Sn and Bi to a total mass of the aluminum foil being 0.0075 mass % or more and 15 mass % or less;
- a ratio of a total surface area of Sn and Bi to a total surface area of the aluminum foil is 0.01% or more and 65% or less, and the ratio of the total surface area is 5 times or more a ratio of a total volume of Sn and Bi to a volume of Al.
Dependencies are inferred from the claim text.