Electrically conductive solder non-wettable bond pads in head gimbal assemblies

A head gimbal assembly, comprising:

• a suspension comprising multiple electrical pads;
• and
• a magnetic recording head comprising:
• a body comprising a trailing surface;
• a plurality of bond pads in a row, each of which is spaced by a gap from an adjacent bond pad along a width of the trailing surface, wherein each bond pad comprises:
• a base layer comprising a top surface;
• a top edge defining a width of the bond pad;
• at least one solder dam comprising a coating layer covering at least a portion of the top surface of the base layer, wherein the at least one solder dam comprises a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads;
• and
• two side edges spaced from each other across the width of the bond pad, wherein a width of the gap between adjacent bond pads is defined by one side edge of each of two adjacent bond pads;
• and
• at least one solder joint having a top edge adjacent to the at least one solder dam, wherein each solder joint electrically connects one of the bond pads to one of the electrical pads of the suspension,
• wherein at least a portion of the coating layer comprises an alloy of Ruthenium (Ru) and Titanium (Ti).