Method for manufacturing a smart card module and a smart card
AssigneeLinxens Holding
InventorEric Eymard
Life of this patent
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Abstract
The invention relates to a method for producing a chip card module. According to this method, the following are produced: a module with a substrate having contacts and an electronic chip connected to at least some contacts; an antenna on a carrier, this antenna including two ends, each equipped with a connection land; a cavity in at least one layer of the card at least partially covering the carrier, in order to house the module and to expose the connection lands of the antenna; a first end of a wire is connected directly to a connection pad of the chip, and another portion is connected directly to a connection land of the antenna, after having inserted the module into the cavity.
Claims13
A method for producing a chip card module comprising:
- a step where a substrate having a first main face and a second main face is provided, with, on the first main face of the substrate, contacts for making a temporary electrical connection with a contact card reader device;
- a step where an electronic chip is attached to the substrate;
- a step where a first end of at least one wire is connected directly to a connection pad of the chip, and the chip and the first end of the at least one wire are encapsulated in a resin, characterized in that a second end of the at least one wire is left outside the resin for a direct connection with at least one antenna pad located on a carrier which is different from the substrate.
A method for producing a chip card comprising:
- production of a module comprising a substrate having a first main face and a second main face, with, on the first main face of the substrate, contacts for making a temporary electrical connection with a contact card reader device, and comprising an electronic chip attached to the substrate;
- production of an antenna on a carrier which is different from the substrate, this antenna comprising two ends, each equipped with a connection land;
- production of a cavity in at least one layer of the card at least partially covering the carrier, in order to house the module and to expose the connection lands of the antenna;
- direct connection of a first end of at least one wire to a connection pad of the chip,
- characterised in that a portion of the at least one wire is connected directly to at least one of the connection lands of the antenna.
A chip card module comprising:
- a substrate having a first main face and a second main face, with, on the first main face of the substrate, contacts for making a temporary electrical connection with a contact card reader device;
- an electronic chip fixed to the substrate;
- at least one wire connected, by a first end, to a connection pad of the chip,
- in which the chip and the first end of the at least one wire are encapsulated in a resin,
- characterized in that a portion of the at least one wire extends out of the resin for a direct connection with an antenna pad located on a carrier which is different from the substrate.
A chip card comprising a module with a substrate and a chip on the substrate, and an antenna, characterized in that the chip card comprises at least one wire having a first end connected directly to a connection pad of the chip and a portion connected directly to a connection land of the antenna, where the antenna is located on a carrier which is different from the substrate, in which the first end of the at least one wire is encapsulated, with the chip, in a resin and a portion of the at least one wire outside the encapsulation resin is soldered, through an opening made in a hot-melt sheet, to the connection land of the antenna.
Dependencies are inferred from the claim text.