Heat removal from memory modules

A computing device comprising:

• a first plurality of memory modules mounted in parallel on a first printed circuit board;
• a first coolant tube assembly comprising:
• a first frame mounted on the first printed circuit board;
• and
• a first plurality of coolant tubes installed in parallel in the first frame;
• wherein
• the first frame has a plurality of openings interleaved with the first plurality of coolant tubes, and
• each of the first plurality of memory modules extends through a respective one of the plurality of openings;
• and
• a first plurality of thermally conductive heat spreaders interleaved with the first plurality of memory modules, each of the first plurality of thermally conductive heat spreaders comprising:
• a first base having a first outer surface thermally coupled to one of the first plurality of coolant tubes;
• a first fin extending from the first base and having a first spring force, wherein the first fin contacts a first memory module of the first plurality of memory modules to thermally couple the first fin and the first memory module;
• and
• a second fin extending from the first base and having a second spring force, wherein the second fin contacts a second memory module of the first plurality of memory modules to thermally couple the second fin and the second memory module, the second memory module adjacent to the first memory module.

A method for cooling memory modules mounted in parallel on a printed circuit board, the method comprising:

• mounting a thermally conductive heat spreader in parallel between two of the memory modules, the thermally conductive heat spreader comprising a first fin and a second fin extending from a base, the first fin having a first spring force toward a first one of the two of the memory modules, the second fin having a second spring force toward a second one of the two of the memory modules, and the thermally conductive heat spreader mounted such that an outer surface of the base is thermally coupled to a coolant tube installed on the printed circuit board;
• mounting a frame on the printed circuit board, wherein the coolant tube is installed in the frame, wherein the frame defines a plurality of openings, and each of the plurality of memory modules extends through a respective one of the openings of the plurality of openings;
• flexing the first and second fins in directions opposing the first spring force and the second spring force;
• releasing the first fin so that the first spring force causes the first fin to provide contact pressure to the first one of the memory modules to thermally couple the first fin and the first one of the memory modules;
• and
• releasing the second fin so that the second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module, wherein a conductive thermal path is created from the first and second ones of the memory modules through the first fin and the second fin to a coolant within the coolant tube.