Light-emitting module manufacturing method and display device

A method of manufacturing a light-emitting module, comprising:

• aligning a plurality of first to third light-emitting devices on a first carrier film;
• forming a molding layer on the first carrier film and the plurality of first to third light-emitting devices;
• forming a plurality of light-emitting units by cutting the molding layer;
• and
• mounting the plurality of light-emitting units on a substrate,
• wherein a black matrix is disposed between the plurality of light-emitting units,
• wherein the light-emitting unit includes:
• a first light-emitting device mounted directly on the substrate and configured to emit a red wavelength;
• a second light-emitting device mounted directly on the substrate and configured to emit a green wavelength;
• a third light-emitting device mounted directly on the substrate and configured to emit a blue wavelength;
• and
• a molding part covering the first to third light-emitting devices,
• wherein each of the first to third light-emitting devices has a width of 200 μm or less,
• the light-emitting unit and the black matrix are a chip on board (COB) type, and
• wherein a height between an upper surface of the molding part and upper surfaces of the first to third light-emitting devices is less than 50% of a height of a sapphire substrate of each of the first to third light-emitting devices.