Photonic integrated circuit packages
AssigneeSamsung Electronics Co., Ltd.
InventorsHo Chul Ji, Keun Yeong Cho
Life of this patent
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Abstract
A photonic integrated circuit package includes a first substrate including a first mirror and an optical coupling device spaced apart from each other, and a second substrate on an upper portion of the first substrate, the second substrate including an electro-optical converter and a second mirror, the electro-optical converter to output an optical signal to the first mirror, and the second mirror to reflect an optical signal reflected by and received from the first mirror to the optical coupling device.
Claims19
A photonic integrated circuit package, comprising:
- a first substrate including a first mirror and a grating coupler spaced apart from each other;
- and
- a second substrate on an upper portion of the first substrate, the second substrate including a light source, a second mirror, and an optical fiber, the light source to output an optical signal to the first mirror, the second mirror to reflect the optical signal reflected by and received from the first mirror to the grating coupler, and the optical fiber to receive the optical signal from the grating coupler,
- wherein the light source is in a recessed region of a lower surface of the second substrate.
A photonic integrated circuit package, comprising:
- a first substrate including a first mirror and a grating coupler;
- and
- a second substrate on an upper portion of the first substrate, the second substrate including a light source, a second mirror, and an optical fiber,
- wherein the first and second mirrors are on opposite surfaces of the first and second substrates, respectively, and
- wherein the light source is in a recessed region of a lower surface of the second substrate.
A photonic integrated circuit package, comprising:
- a photonic integrated circuit substrate including a base substrate, a first insulating layer, an optical core layer with a grating coupler, and a second insulating layer, stacked in sequence;
- a first concave mirror in a recessed portion of an upper surface of the second insulating layer;
- and
- an optical bench on the photonic integrated circuit substrate, the optical bench including a light source in a recessed region of a lower surface of the optical bench, an optical fiber, and a second concave mirror in a recessed portion of the lower surface of the optical bench.
Dependencies are inferred from the claim text.