Method of testing semiconductor packages

A method of testing semiconductor packages, which performs an electrical test on the semiconductor packages after receiving the semiconductor packages into insert pockets of a test tray and connecting with sockets of a tester by using pusher units each comprising a heater, the method comprising:

• receiving temperature information of the semiconductor packages from the tester while testing the semiconductor packages;
• calculating an overall average temperature of the semiconductor packages from the received temperature information;
• compensating set temperatures of heaters of the pusher units as a whole with a first compensation value to compensate for a first difference value between the overall average temperature and a predetermined test reference temperature of the semiconductor packages;
• and
• individually compensating the set temperatures of the heaters with second compensation values to compensate for second difference values between the overall average temperature and individual temperatures of the semiconductor packages.

A method of testing semiconductor packages, which performs an electrical test on the semiconductor packages after receiving the semiconductor packages into insert pockets of a test tray and connecting with sockets of a tester by using pusher units each comprising a heater, the method comprising:

• repeatedly performing a test process on a predetermined number of test trays in which semiconductor packages are received;
• receiving temperature information of the semiconductor packages received in the test trays from the tester while repeatedly performing the test process;
• calculating an overall average temperature of the semiconductor packages received in the test trays from the received temperature information;
• calculating individual average temperatures of semiconductor packages received in insert pockets at the same locations of the test trays from the received temperature information, respectively;
• and
• individually controlling operations of heaters of the pusher units based on difference values between the overall average temperature and individual average temperatures of the semiconductor packages.

A method of testing semiconductor packages, which performs an electrical test on the semiconductor packages after receiving the semiconductor packages into insert pockets of a test tray and connecting with sockets of a tester by using pusher units each comprising a heater, the method comprising:

• repeatedly performing a test process on a predetermined number of test trays in which semiconductor packages are received;
• receiving temperature information of the semiconductor packages received in the test trays from the tester while repeatedly performing the test process;
• calculating an overall average temperature of the semiconductor packages received in the test trays from the received temperature information;
• calculating individual average temperatures of semiconductor packages received in insert pockets at the same locations of the test trays from the received temperature information, respectively;
• compensating set temperatures of heaters of the pusher units as a whole with a first compensation value to compensate for a first difference value between the overall average temperature and a predetermined test reference temperature of the semiconductor packages;
• and
• individually compensating the set temperatures of the heaters with second compensation values to compensate for second difference values between the overall average temperature and individual average temperatures of the semiconductor packages.