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US 10,705,132 B2Granted
Semiconductor chip with fracture detection
AssigneeInfineon Technologies AG
InventorsThomas Zettler, Dirk Hammerschmidt, Friedrich Rasbornig, Wolfgang Scheibenzuber, Hans-Joerg Wagner
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Abstract
A method including feeding a test signal into a first end of a conductor track of a semiconductor chip, wherein the conductor track crosses an indentation of a substrate of the semiconductor chip; and detecting the test signal at a second ends of the conductor track, which wherein the detected test signal is indicative of fracture of the substrate of the semiconductor chip at the indentation.
Claims20
A method, comprising:
- feeding a test signal into a first end of a conductor track of a semiconductor chip, wherein the conductor track crosses an indentation of a substrate of the semiconductor chip;
- and
- detecting the test signal at a second end of the conductor track, wherein the detected test signal has a changed characteristic indicative of fracture of the substrate of the semiconductor chip at the indentation.
A method, comprising:
- feeding a test signal into a first end of a conductor track of a semiconductor chip, wherein the conductor track crosses an indentation of a substrate of the semiconductor chip;
- detecting the test signal at a second end of the conductor track of the semiconductor chip, wherein the detected test signal is indicative of fracture of the substrate of the semiconductor chip at the indentation of the substrate;
- and
- depending on the detection, providing an output signal from at least one of a first component and a second component of an integrated circuit arranged on the substrate,
- wherein the first component and the second component are configured to output redundant output signals.
2 more elements
Dependencies are inferred from the claim text.