Test socket of flexible semiconductor chip package and bending test method using the same

A bending test method of a flexible semiconductor chip package, comprising:

• mounting a semiconductor chip package in a test socket, wherein the semiconductor chip package comprises a flexible tape and a semiconductor chip disposed on the flexible tape, and wherein the test socket comprises a top guide, a tape guide, a bottom guide, a first bolt extending from a first bending jig and a second bolt extending from a second bending jig;
• contacting a convex contoured surface of the first bending jig with the semiconductor chip;
• fastening the second bolt to drive a concave contoured surface of the second bending jig to contact a surface of the flexible tape;
• and
• fixing the semiconductor chip in a bent state between the first bending jig and the second bending jig.

A bending test apparatus comprising:

• a test socket;
• a first bending jig having a continuously convex contour disposed in the test socket;
• a second bending jig having a concave contour disposed to matingly engage the first bending jig;
• a semiconductor chip disposed between the first bending jig and the second bending jig, wherein the semiconductor chip is disposed on a flexible film;
• and
• a test board configured to connect and test electrical performance of the semiconductor chip.