Micro sensor package
AssigneePoint Engineering Co., Ltd.
InventorsBum Mo Ahn, Seung Ho Park, Tae Hwan Song
Life of this patent
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Abstract
Disclosed is a microsensor package. Particularly, disclosed is a microsensor package configured such that a substrate with a sensor electrode is formed with a plurality of pores penetrating vertically therethrough, the lower surface of the substrate is formed with a bonding portion, and the pores under the sensor electrode pad are provided therein with respective connecting portions electrically connecting the sensor electrode pad and the bonding portion, whereby it is possible to provide a light, slim, and compact microsensor package, and it is possible to mount the microsensor package to a printed circuit board (PCB) without wire bonding.
Claims11
A microsensor package comprising:
- a sensing chip,
- wherein the sensing chip includes:
- a substrate;
- a sensor electrode provided on the substrate, the sensor electrode including a sensor wire and a sensor electrode pad connected to the sensor wire;
- and
- a sensing material formed to cover the sensor wire,
- wherein a bonding portion is provided on a lower surface of the substrate, so as to be electrically connected to a printed circuit board (PCB),
- wherein the substrate is made of an anodized aluminum oxide (AAO) material, and the substrate is provided with a first plurality of pores formed by removing an aluminum and a barrier layer from the AAO material in a vertical direction,
- wherein a second plurality of pores under the sensor electrode pad among the first plurality of pores are formed through the substrate in the vertical direction,
- wherein each of the second plurality of pores under the sensor electrode pad is provided therein with a respective one of connecting portions electrically connecting the sensor electrode pad and the bonding portion to each other, and
- wherein each of the connecting portions electrically connecting the sensor electrode pad and the bonding portion is formed in a columnar shape.
Dependencies are inferred from the claim text.