LED filament and light bulb

An LED filament, comprising:

• a linear array of LED chips operably interconnected to emit light upon energization;
• two conductive electrodes electrically connected to the linear array of LED chips;
• a plurality of electrical conductors electrically connecting the linear array of LED chips and the two conductive electrodes;
• and
• a light conversion coating covering the linear array of LED chips and the plurality of electric conductors, wherein:
• the light conversion coating includes a top layer and a base layer conformally interconnected to form a unitary enclosure;
• the linear array of LED chips is carried by the unitary enclosure;
• and
• a first LED chip in the linear array of LED chip is guided by the unitary enclosure to a different angle in relation to a second LED chip in the linear array of the LED chips,
• the top layer is coated on a first side of the linear array of LED chips and the two conductive electrodes;
• and
• the base layer is coated on a second side of the linear array of LED chips and the two conductive electrodes;
• the base layer is harder than the top layer;
• the top layer includes a first adhesive binder doped with phosphor particles and inorganic oxide particles;
• the base layer includes a second adhesive binder doped with phosphor particles and inorganic oxide particles;
• the second adhesive binder is harder than the first adhesive binder;
• the linear array of LED chips are bonded on the top surface of the base layer by a glue;
• the base layer further comprises a first portion and a second portion, the first portion is harder than the second portion and the linear array of LED chips is mounted on the first portion;
• the second portion of the base layer is arranged between the LED chips.

An LED light bulb, comprising:

• a bulb shell;
• a bulb base connected with the bulb shell;
• two conductive supports disposed in the bulb shell;
• a driving circuit disposed in the bulb base and electrically connected to the two conductive supports and the bulb base;
• and
• an LED filament disposed in the bulb shell and electrically connected to the two conductive supports, the LED filament comprising:
• a linear array of LED chips operably interconnected to emit light upon energization;
• two conductive electrodes electrically connected to the linear array of LED chips and the two conductive supports;
• a plurality of electrical conductors electrically connecting the linear array of LED chips and the conductive electrode;
• and
• a light conversion coating covering the linear array of LED chips and the plurality of electric conductors, wherein:
• the light conversion coating includes a top layer and a base layer conformally interconnected to form a unitary enclosure;
• the linear array of LED chips is carried by the unitary enclosure;
• a first LED chip in the linear array of LED chip is guided by the unitary enclosure to a different angle in relation to a second LED chip in the linear array of the LED chips;
• the top layer is coated on a first side of the linear array of LED chips and the two conductive electrodes;
• and the base layer is coated on a second side of the linear array of LED chips and the two conductive electrode;
• the base layer is harder than the top layer;
• the top layer includes a first adhesive binder doped with phosphor particles and inorganic oxide particles;
• the base layer includes a second adhesive binder doped with phosphor particles and inorganic oxide particles;
• the second adhesive binder is harder than the first adhesive binder;
• the linear array of LED chips are bonded on the top surface of the base layer by a glue;
• the top layer and the base layer jointly configure an uneven interface;
• the linear array of LED chips is sandwiched between the top layer and the base layer;
• and
• a first LED chip in the linear array of LED chips is guided by the uneven interface to a different angle in relation to a second LED chip in the linear array of the LED chips.