Adhesive delamination layer including at least one non-linear organopolysiloxane

A method of processing a display device substrate, the method comprising:

• securing the display device substrate to a carrier substrate with an adhesive delamination layer comprising a cured product of curing a precursor adhesive composition comprising:
• 0.1 wt % to 99 wt % Component (A), wherein Component (A) is a hydrogenorganopolysiloxane chosen from (HR12SiO1/2)2(R12SiO2/2)1-2000 and (HR12SiO1/2)m1(R13SiO1/2)m2(HR1SiO2/2)d1(R12SiO2/2)d2(R1SiO3/2)t1(HSiO3/2)t2(SiO4/2)q1, wherein subscripts m1, m2, d1, d2, t1, t2, and q1 represent mole fractions of their respective repeat units such that the sum of m1+m2+d1+d2+t1+t2+q1=1;
• wherein m1 is from 0 to 0.8, m2 is from 0 to 0.8, d1 is from 0 to 0.999, d2 is from 0 to 0.9999, t1 is from 0 to 0.8, t2 is from 0 to 0.8, and q1 is from 0 to 0.99;
• and
• 0.1 wt % to 99.9 wt % Component (B), wherein Component (B) is an alkenyl-functionalized organopolysiloxane chosen from (R2R12SiO1/2)2(Me2SiO2/2)1-2000 and (R2R12SiO1/2)m1(R13SiO1/2)m2(R2R1SiO2/2)d1(R12SiO2/2)d2(R1SiO3/2)t1(R2SiO3/2)t2(SiO4/2)q1, wherein subscripts m1, m2, d1, d2, t1, t2, and q1 represent mole fractions of their respective repeat units such that the sum of m1+m2+d1+d2+t1+t2+q1=1;
• wherein m1 is from 0 to 0.8, m2 is from 0 to 0.8, d1 is from 0 to 0.9999, d2 is from 0 to 0.9999, t1 is from 0 to 0.8, t2 is from 0 to 0.8, and q1 is from 0 to 0.99;
• wherein
• at least one of Component (A) and Component (B) is non-linear,
• at each occurrence in Component (A) and (B) R1 is independently a substituted or unsubstituted (C1-C20)hydrocarbyl interrupted with 0, 1, 2, or 3 groups chosen from —O—, —S—, substituted or unsubstituted —NH—, —Si((C1-C5)alkoxy)2-, and —Si((C1-C5)alkyl)2-, and
• at each occurrence in Component (B), R2 is independently a substituted or unsubstituted (C2-C20)alkenyl interrupted with 0, 1, 2, or 3 groups chosen from —O—, —S—, substituted or unsubstituted —NH—, —(O—(C2-C3)alkylene)n- wherein n is 1 to 1,000, —Si((C1-C5)alkoxy)2-, and —Si((C1-C5)alkyl)2-;
• and wherein the securing provides a display device processing intermediate wherein an adhesion promoter layer is between the carrier substrate and the adhesive delamination layer and/or a release layer is between the adhesive delamination layer and the display device substrate.

A display device processing intermediate comprising:

• a carrier substrate;
• an adhesive delamination layer on the carrier substrate comprising a cured product of curing a precursor adhesive composition comprising
• Component (A), a hydrogenorganopolysiloxane;
• and
• Component (B), a (C2-C20)alkenyl-functionalized organopolysiloxane, wherein the (C2-C20)alkenyl group is uninterrupted or interrupted by 1, 2, or 3 groups independently chosen from —O—, —S—, substituted or unsubstituted —NH—, —(O—(C2-C3)alkylene)n- wherein n is 1 to 1,000, —Si((C1-C5)alkoxy)2-, and —Si((C1-C5)alkyl)2-;
• wherein at least one of Component (A) and Component (B) is non-linear;
• and
• a display device substrate secured to the carrier substrate via the adhesive delamination layer;
• and wherein the display device processing intermediate has an adhesion promoter layer between the carrier substrate and the adhesive delamination layer and/or a release layer between the adhesive delamination layer and the display device substrate.